ASML said Samsung, TSMC, and Intel are all moving forward with its High-NA EUV lithography systems.
ASML CTO Marco Pieters said larger masks could increase High-NA machine throughput by 40%.

ASML said Samsung, TSMC, and Intel are all moving forward with its High-NA EUV lithography systems.
ASML CTO Marco Pieters said larger masks could increase High-NA machine throughput by 40%.