Explore

@edsonbellido.bsky.social Oct 9, 2026, 12:30 AM

2/4 Scope: joint process and equipment R&D across FEOL, BEOL, and packaging. Targets: higher interconnect density, better power delivery, thermal headroom for agentic AI HPC. Plus new logic materials and Foveros 3D stacking. #Chips #AdvancedPackaging

@mengli512.bsky.social Oct 2, 2026, 7:52 AM

Is Teradyne stock a sustainable long-term investment, or does the recent revenue guidance drop signal trouble for the company?

#ai #testing #robotics #optical #chip #memory #advancedpackaging $TER $ROK $ZBRA
youtu.be/m7ytk0_1-SU

@edsonbellido.bsky.social Oct 1, 2026, 9:00 PM

Full capacity arrives by 2029 at about 44,000 wafers per month with 1,600 jobs. For NXP this is automotive and industrial supply security. For the industry, more 300mm capacity where analog flows meet interposer demand. #AutomotiveChips #AdvancedPackaging

@edsonbellido.bsky.social Sep 30, 2026, 7:00 PM

Memory bandwidth and system in package architectures are evolving rapidly. Projections show 2029 memory benchmarks increasing drastically, with HBM bandwidth scaling 34x and 3D DRAM jumping 115x. #Semiconductors #AdvancedPackaging

@iwpost.bsky.social Sep 30, 2026, 1:00 AM

The real loops of innovation#advancedpackaging #Block2 #chipmanufacturing #Connectivity #highbandwidthmemory #semiconductors #Technology

@jissonews.bsky.social Sep 24, 2026, 7:25 AM

10月30日(金)13:00-17:20に、エレクトロニクス実装学会 #JIEP 先進実装・電子部品研究会が公開研究会『インターコネクション技術の最前線』を開催。講演6件。先進パッケージング・ファーストレベル相互接続技術、はんだ付けの最新技術、エリアレーザによるリフロー、AI時代のモールディング技術、ガラス基材への導体層形成、大気圧プラズマ。東京都杉並区・回路会館およびオンラインにて。詳細は jiep.or.jp/tech-comm... に。
#Seminar #AdvancedPackaging #Interconnection

@michel-k-tech.bsky.social Sep 17, 2026, 5:51 AM

PieceMakers is taking a memory-first route for edge AI, bonding DRAM closer to the processor instead of leaning on HBM-heavy designs.

#tech #technology #edgeai #dram #advancedpackaging #aimemory

techshowup.com/News/Article/…

@wilayahmy.bsky.social Sep 8, 2026, 11:08 AM

Spirox Launches High-Speed TGV Crack Inspection System to Support High-Volume Glass Substrate Inspection #Spirox #TGVInspection #GlassTechnology #AdvancedPackaging #AIApplications

@mengli512.bsky.social Sep 7, 2026, 8:28 AM

Advanced packaging has become the supply-chain bottleneck for AI compute, and the profit pools are shifting from packagers to the tools and materials they cannot replace.
#Advancedpackaging #AI $TSM $NVDA
chippub.substack.com/p/rethinking...