🏭 TOK approved its Koriyama photoresist plant in 2023 citing "medium-to-long-term growth." No mention of AI.
It was completed Oct 8, 2026 (¥23B), just as its EUV/ArF resist sales jumped 35% on HBM and AI chip demand.
@oddlytruejp.bsky.social
@oddlytruejp.bsky.social🏭 TOK approved its Koriyama photoresist plant in 2023 citing "medium-to-long-term growth." No mention of AI.
It was completed Oct 8, 2026 (¥23B), just as its EUV/ArF resist sales jumped 35% on HBM and AI chip demand.
@mengli512.bsky.socialSK hynix exec Ahn Hyun spoke at SEDEX 2026 on Oct 14. AI inference demand is growing in three ways at once: harder tasks, longer context, and more requests. Together they are driving rapid growth in compute infrastructure.
$SKHY #HBM #DRAM
aidisruption.ai/p/claude-cod...
@trendpick.bsky.social
@edsonbellido.bsky.social2/4 The numbers: revenue ₩195T, up 126.6% YoY. Operating profit up 782.5% YoY at a record 55.1% margin. That beats Nvidia ($63.7B), Alphabet ($40.8B), Microsoft ($40.6B), and Apple ($35.7B). The DS chip division alone: ~₩110T. #Memory #HBM
@edsonbellido.bsky.social2/4 The split: 2.5D routes compute dies and HBM across a silicon or RDL interposer, signals just millimeters long. 3D stacks dies via TSVs or hybrid bonds. TSMC 3nm SoIC reached volume production in 2025 below 10 µm pitch; UCIe 2.0 targets ~1 µm. #HBM #Chiplets
@edsonbellido.bsky.social1/4 Samsung's 12-Hi HBM4E reportedly passed NVIDIA and hyperscaler qualification. 🧪 But a qualification pass is a gate, not a contract. The HBM4E order book is still unwritten. #HBM #Semiconductors
![SemiRecap Infographic [MARKET_DATA_METRIC]: Samsung 12-Hi HBM4E Clears NVIDIA Qualification. A 2.5D vector cartoon on solid white background (#FFFFFF) showing a Deep Maroon (#450d16) 12-layer HBM4E stack with warm gold pins labeled '12-HI HBM4E 48 GB' passing through a cyan qualification gate stamped 'NVIDIA + HYPERSCALERS PASSED', a bandwidth gauge reading '14 GBPS ➔ 3.6 TB/S', and a dashed amber pipeline leading toward a wafer silhouette tagged 'VOLUMES TBD'.](https://cdn.bsky.app/img/feed_fullsize/plain/did:plc:nxdiuv7626cjwxguzjlh4o3b/bafkreiftka7ndih6rrhrgeycpsbc7xptqi4gohwwytvwazun2se3xyx3o4@png)
@imtechboss.bsky.social⚡ The HBM Memory Supercycle: Why Micron and SK Hynix Sold Out AI VRAM Capacities Through 2027
High-Bandwidth Memory (HBM3e and HBM...
👉 Full Story: https://imtechboss.com/post.html?id=hbm-memory-supercycle-micron-sk-hynix-sold-out-ai-vram-bottleneck-2026
#Tech #Hardware #HBM
@icgoodfind.bsky.socialSIA: Global Semiconductor Sales Surpass $1 Trillion for First Time in First 8 Months of 2026 #SIA #Semiconductor #AIChip #HBM #ChipMarket #ICGOODFIND
@elfolio.bsky.socialSamsung rompe récords con un beneficio operativo disparado por los chips de IA y la memoria de alto rendimiento. #Samsung #InteligenciaArtificial #IA #Semiconductores #Chips #Tecnologia #Nvidia #HBM #Mercados #Empresas #CoreaDelSur #felizjueves #8deoctubre
@kautious.comSamsung Q3 operating profit: ₩107.4T, +782.5% y/y—AI memory demand drives the surge.
Revenue: ₩195.0T (+127%), below cited ₩200–201.9T estimates; profit beat some, missed others. Watch Oct. 29 results for HBM4, DRAM pricing and supply.
$MU #HBM
@edsonbellido.bsky.social3/4 Micron's HBM4E core dies move to its 1γ node while the base die goes to TSMC on a 3nm class process. COO Manish Bhatia says the customization lifts ASP and margin. Does outsourcing the control layer strengthen the premium or erode it? #Semiconductors #HBM
@edsonbellido.bsky.social1/4 🧠 Micron will buy its NVHBM base die from TSMC instead of building it, and still expects better margins. The bet: NVIDIA's custom logic inside that die creates value worth more than the foundry bill. #Semiconductors #HBM
![SemiRecap Infographic [HARDWARE_DEEP_DIVE]: Micron Bets NVHBM Margins on Outsourced Base Die. A 2.5D vector cartoon illustration on a solid white background (#FFFFFF) showing an exploded HBM4E memory stack: a vertical column of Deep Maroon (#450d16) DRAM core dies labeled '1γ CORE DIES' with warm gold pins, seated above a larger custom base die labeled 'CUSTOM BASE DIE (TSMC 3NM CLASS)' containing a visible 'MEMORY CONTROLLER' block and a 'CUSTOM I/O PHY' block along its edge. Cyan bus traces run from the base die across an 'NVLINK FUSION' interconnect into a Deep Maroon 'NVIDIA AI GPU' package, visualizing the controller migration that cuts HBM power 15% and lifts bandwidth up to 30%.](https://cdn.bsky.app/img/feed_fullsize/plain/did:plc:nxdiuv7626cjwxguzjlh4o3b/bafkreieqgvbuys36iun2bsodef4n4wshqgxo2pz3ybvkanfl4mjflsgoyu@png)
@edsonbellido.bsky.social3/4 Micron is the only US HBM maker, working with Nvidia on the industry's first custom HBM. A $250B buildout spans campuses in Clay, New York and Boise, Idaho, while SK Hynix and Samsung expand in Korea. Memory costs are lifting iPad and MacBook prices. #AIHardware #HBM
@edsonbellido.bsky.social1/4 Micron just posted a $54.23B quarter, nearly 4x the $11.32B from a year ago, and guided fiscal Q1 to about $61.5B revenue and $38.15 EPS. 📈 DRAM revenue alone grew 343% to $39.8B, 73% of total sales. #Micron #HBM #Semiconductors
![SemiRecap Infographic: Micron beats on earnings and issues strong guidance as data center revenue jumps 11-fold [Bluesky]](https://cdn.bsky.app/img/feed_fullsize/plain/did:plc:nxdiuv7626cjwxguzjlh4o3b/bafkreibpyj7aoh56n3rijc4chudzlph6dy6d4wjuyrqhvy2rujak2hbtuu@png)
@pulseofnations.lol
@el0j.bsky.social
@semiconshinbun.bsky.social【新着記事】
HBMはなぜ速いのか――クロック周波数より「道幅」で考える
HBMは「積層したから速い」のか。帯域幅を1本当たりの速度と車線数に分け、1024ビット級のI/O、TSV、インターポーザー、並列チャネルがどう結び付くかを整理した。広帯域と低レイテンシの違い、ピーク帯域を使い切れない理由も図で読む。
https://semiconshinbun.com/articles/hbm-wide-interface-bandwidth
@techscope365.bsky.social📝 「メモリの価格爆発」が2028年も続く理由――MicronCEOの警告が示す、AI時代のインフラ逼迫の本質
Micron CEOが衝撃の警告を発表。メモリ不足が2028年以降も継続し、顧客は現在の「はるかに高い価格」を支払うことになるという。なぜAI革命は深刻なインフラ危機を招いているのか。
🔗 https://techscope365.com/2989/
#メモリ不足 #HBM #サプライチェン #AI #テクノロジー
@edsonbellido.bsky.socialThe mechanics: 26 take or pay SCAs with terms extending into 2031. Minimum contracted backlog sits near $150B at floor prices. About 75% of that revenue carries price floors and ceilings, backed by $32B in customer commitments, mostly cash. #DRAM #HBM
@winbuzzer.comMemory maker Micron expects AI-driven memory demand to outpace expanding supply through 2028, intensifying competition for chips among data-center and device makers.