Glass substrates may reach mass production before CPO as AI chip packages grow, but can they overcome TGV, warpage, and copper filling challenges?
#Glasssubstrates #CPO #chip #TGV $GLW $AMAT
chippub.substack.com/p/glass-subs...

Glass substrates may reach mass production before CPO as AI chip packages grow, but can they overcome TGV, warpage, and copper filling challenges?
#Glasssubstrates #CPO #chip #TGV $GLW $AMAT
chippub.substack.com/p/glass-subs...
Intel and AUO Partner on Co-Packaged Optics
#Intel #AUOptronics #Semiconductors #GlassSubstrates #OpticalInterconnects