![SemiRecap Infographic [STRATEGIC_PARTNERSHIP_MOU]: GlobalFoundries and TSMC Strike $2B U.S. Packaging Deal. A 2.5D vector cartoon illustration on solid white background (#FFFFFF) showing GlobalFoundries' Malta, New York fab module on the left with a maroon wafer processing line labeled 'GF MALTA NY FAB', releasing a thin maroon interposer panel labeled 'SILICON INTERPOSER' with gold micro-trench features labeled 'DEEP TRENCH CAPACITOR'. The interposer travels along a cyan bus trace across a handshake interface zone marked 'MANUFACTURING AGREEMENT' into TSMC's CoWoS advanced packaging station on the right, where the interposer docks beneath an AI accelerator die labeled 'AI / HPC PACKAGE' with warm gold bonding bumps. Deep Maroon (#450d16) chip bodies, warm gold pins, cyan interconnect traces, and minimal clean structural labels identifying both partners and the interposer handoff.](https://cdn.bsky.app/img/feed_fullsize/plain/did:plc:nxdiuv7626cjwxguzjlh4o3b/bafkreifjem4yzqxmze2u5f2djxs6hvhfogpmyxz27t3jyx7g5dw6pskska@png)
@pulseofnations.lolTSMC plans to have CoWoS interposers manufactured at GlobalFoundries, igor'sLAB reports, the first external partner for the packaging tech behind Nvidia and AMD AI chips.
@edsonbellido.bsky.social4/4 Source: Semiconductor Digest — https://www.semiconductor-digest.com/globalfoundries-tsmc-agreement-for-u-s-ai-chip-packaging-components/ #Semiconductors #AdvancedPackaging #CoWoS
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