Chiplets could be one of the biggest shifts in server design since the rise of the monolithic CPU.
🖇️ This article explores why chiplets matter now — and why data center leaders should be paying attention: www.datacenterknowledge.com/data-center-...

2/4 The split: 2.5D routes compute dies and HBM across a silicon or RDL interposer, signals just millimeters long. 3D stacks dies via TSVs or hybrid bonds. TSMC 3nm SoIC reached volume production in 2025 below 10 µm pitch; UCIe 2.0 targets ~1 µm. #HBM #Chiplets
Chiplets could be one of the biggest shifts in server design since the rise of the monolithic CPU.
🖇️ This article explores why chiplets matter now — and why data center leaders should be paying attention: www.datacenterknowledge.com/data-center-...
Featured in #JSSC: 3-nm FinFET UCIe transceivers for advanced & standard packaging! 📡⚡
• AP (CoWoS): 0.29 pJ/b @ 5.27 Tb/s/mm
• SP (Organic): 0.52 pJ/b @ 0.448 Tb/s/mm
By D. Turker Melek et al.